Shenzhen Eton Automation Equipment Co., Ltd.
Shenzhen Eton Automation Equipment Co., Ltd. Innovation Technology,Service Foremost,Keep Improving
Add to Cart
SMT pick and place machine can produce infinite long LED strip with fast capacity
Product description
1. The function is specific, applied to the flexible light strip without wires, but the production speed is very fast, breaking the world record, and it can reach 500000CPH under optimal environmental conditions.
2. The size of the PCB board is 250mm*any length, no matter how long you want to produce flexible light strips, it is supported.
3. Dual-track board feeding, dual-module dual-system, can share a placement machine and reflow soldering at the same time, and produce two different PCB boards at the same time, such as light strips of different colors and so on.
4. Exclusive patent for group fetching and group sticking, two picks and one mount.
Feature
| PCB size( Width*Length) | 250(± 10)mm*Any length |
| PCB thickness | 0.1 -0.5mm |
| PCB clamping | Vacuum adsorption, cylinder clamping, track width adjustable |
| Mounting way | Group picking and group placing |
| Mounting mode | Double rail + Four groups of placement heads |
| Repeat precision | ±0.05mm |
| Power consumption | 9.6KW |
| Mounting speed | Double side:500000CPH,single side:250000CPH(Optimum speed) |
Appliance
The minimum mounted component is 0603, and the maximum component size will not exceed 6mm.
Suitable for outdoor flexible light strips, no wire flexible light strips.
Service
Market share
In the field of SMT, ETON occupies half of the domestic market, and more than 80% of LED lamp manufacturers are our customers. Not only that, we actively export overseas. So far, overseas customers are located in more than 20 countries and regions around the world.
Development of SMT
With the development of IC packaging towards high integration, high performance, multi-lead and narrow pitch, it promotes the wide application of SMT technology in high-end electronic products, but due to the limitation of process capability, it faces many technical difficulties. After 1998, BGA devices began to be widely used, especially in the communication manufacturing industry, the application ratio of BGA devices showed a rapid growth, and at the same time, SMT technology, driven by high-end products such as communication, entered a period of rapid and good development. .
Electronic products show the trend of miniaturization and multi-functionalization, especially the market of consumer electronic products represented by mobile phones and MP3 shows explosive growth, which further drives the miniaturization of surface mount components and the high level of product assembly. Densification, 0201 components, CSP, flipchip and other tiny and fine-pitch devices have also entered the practical application of SMT, which greatly improves the application level of SMT technology and also increases the difficulty of the process.